Projects

This project explores the potential of conductive yarn in the fabrication of flexible electronic circuits for wearable applications. Traditional printed circuit boards (PCBs) offer rigidity, but this can lead to vulnerability under stress or force. Here, we propose the integration of the entire circuit within a flexible fabric using conductive yarn, achieving significant improvements in flexibility and durability. Both fabric-based and PCB-based circuits demonstrated strong performance in obstacle detection and showed clear advantages in robustness under deformation. This novel approach not only protects the circuit from damage but also allows for foldable electronic devices, facilitating compact storage and portability.

• Full Technical Report (Will Available Soon)